Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295174 | Substrate dividing method using an expansion tape and a roller | Jaeyoung Lee, Shuzo MITANI, Takayuki Kitano | 2025-05-06 |
| 11610815 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2023-03-21 |
| 11594454 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2023-02-28 |
| 11587832 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2023-02-21 |
| 11587833 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2023-02-21 |
| 11545393 | Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2023-01-03 |
| 11476161 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-10-18 |
| 11393721 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-07-19 |
| 11380588 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-07-05 |
| 11380587 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-07-05 |
| 11361997 | Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-06-14 |
| 11322407 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-05-03 |
| 11322406 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-05-03 |
| 11302578 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-04-12 |
| 11289379 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-03-29 |
| 11270916 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-03-08 |
| 11251082 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2022-02-15 |
| 11127633 | Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-09-21 |
| 11069574 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-07-20 |
| 11062948 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-07-13 |
| 11056334 | Wafer processing method using a ring frame and a polyester sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-07-06 |
| 11049772 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-29 |
| 11049757 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-29 |
| 11043421 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-22 |
| 11037814 | Wafer processing method using a ring frame with a polyester sheet with no adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-15 |