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Taro Arakawa — 41 Patents

DIDisco: 41 patents #13 of 708Top 2%
Tokyo, JP: #2,748 of 90,295 inventorsTop 4%
Overall (All Time): #75,001 of 4,157,543Top 2%
41 Patents All Time
Taro Arakawa has been granted 41 US patents while listed as an inventor at Disco. The first was granted in 2016 and the most recent in March 2023. Taro Arakawa ranks #75,001 of 4,157,543 US inventors in our database (top 1.8%). Patent records list Taro Arakawa in Tokyo, JP.

Issued Patents All Time

Showing 1–25 of 41 patents

Patent #TitleCo-InventorsDate
11610815 Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2023-03-21
11594454 Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2023-02-28
11587832 Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2023-02-21
11587833 Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2023-02-21
11545393 Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2023-01-03
11476161 Wafer processing method including applying a polyolefin sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-10-18
11393721 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-07-19
11380588 Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-07-05
11380587 Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-07-05
11361997 Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-06-14
11322407 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-05-03
11322406 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-05-03
11302578 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-04-12
11289379 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-03-29
11270916 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-03-08
11251082 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2022-02-15
11127633 Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-09-21
11069574 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-07-20
11062948 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-07-13
11056334 Wafer processing method using a ring frame and a polyester sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-07-06
11049772 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-29
11049757 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-29
11043421 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-22
11037814 Wafer processing method using a ring frame with a polyester sheet with no adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-15
11037813 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-15

Nearby-Ranked Inventors

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