TA

Taro Arakawa

DI Disco: 41 patents #13 of 708Top 2%
Overall (All Time): #75,922 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 26–41 of 41 patents

Patent #TitleCo-InventorsDate
11031234 Wafer processing method including applying a polyolefin sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-08
11024543 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-06-01
11018043 Wafer processing method using a ring frame and a polyester sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-05-25
11018058 Wafer processing method for dividing a wafer along predefined division lines using polyester sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-05-25
11011407 Wafer processing method using a ring frame and a polyolefin sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-05-18
11004744 Wafer processing method for dividing a wafer along predefined division lines Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-05-11
10998232 Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-05-04
10991624 Wafer processing method including applying a polyolefin sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-04-27
10991587 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-04-27
10985066 Wafer processing method for dividing a wafer along division lines Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-04-20
10985067 Wafer processing method using a laser beam dividing step Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-04-20
10910269 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-02-02
10896850 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2021-01-19
10847420 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2020-11-24
10720355 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Masamitsu Agari +4 more 2020-07-21
9275848 Processing method for optical device wafer 2016-03-01