Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037813 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-15 |
| 11031234 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-08 |
| 11024543 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-06-01 |
| 11018058 | Wafer processing method for dividing a wafer along predefined division lines using polyester sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-05-25 |
| 11018043 | Wafer processing method using a ring frame and a polyester sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-05-25 |
| 11011407 | Wafer processing method using a ring frame and a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-05-18 |
| 11004744 | Wafer processing method for dividing a wafer along predefined division lines | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-05-11 |
| 10998232 | Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-05-04 |
| 10991624 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-04-27 |
| 10991587 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-04-27 |
| 10985067 | Wafer processing method using a laser beam dividing step | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-04-20 |
| 10985066 | Wafer processing method for dividing a wafer along division lines | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-04-20 |
| 10910269 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-02-02 |
| 10896850 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2021-01-19 |
| 10847404 | Sheet sticking method | — | 2020-11-24 |
| 10847420 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2020-11-24 |
| 10720355 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa +4 more | 2020-07-21 |
| 10438898 | Wafer processing method | Masaru Nakamura | 2019-10-08 |
| 10297501 | Method for dividing wafer into individual chips | Bae Tewoo | 2019-05-21 |