Issued Patents All Time
Showing 25 most recent of 197 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308732 | DCDC converter, integrated circuit, and target voltage generation circuit | Kenji Akatsuki, Takaaki Nojima | 2025-05-20 |
| 12308293 | Method of processing wafer | — | 2025-05-20 |
| 12220289 | Dental floss, continuous dental floss, and method for manufacturing continuous dental floss | Kumiko Yokonuma, Youko Suda, Aki Sato | 2025-02-11 |
| 12191204 | Method of processing wafer and processing apparatus for wafer | — | 2025-01-07 |
| 12186857 | Wafer processing method | — | 2025-01-07 |
| 12106966 | Processing method of wafer | — | 2024-10-01 |
| 12003180 | Power supply for driving synchronous rectification elements of SEPIC converter | Shinji Aso, Jianao Yao | 2024-06-04 |
| 11978645 | Laser processing apparatus | — | 2024-05-07 |
| 11835294 | Heat treatment furnace, heating device, manufacturing method of wire electrode and heat diffusion treatment method | Tetsuro Kawahara, Tomoaki Asaoka | 2023-12-05 |
| 11600513 | Processing method of wafer | — | 2023-03-07 |
| 11583962 | Holding table manufacturing method | — | 2023-02-21 |
| 11519865 | Crack detection method | — | 2022-12-06 |
| 11489299 | Processing apparatus | — | 2022-11-01 |
| 11430696 | Wafer processing method | — | 2022-08-30 |
| 11387133 | Wafer processing method | — | 2022-07-12 |
| 11380550 | Wafer processing method | — | 2022-07-05 |
| 11370084 | Cutting blade shaping method | — | 2022-06-28 |
| 11367656 | Wafer processing method | — | 2022-06-21 |
| 11364573 | Laser processing apparatus including imager of mark of processed workpiece | — | 2022-06-21 |
| 11328956 | Wafer processing method | Hisayuki Yamaoka | 2022-05-10 |
| 11322403 | Wafer processing method | — | 2022-05-03 |
| 11322404 | Wafer processing method | — | 2022-05-03 |
| 11285565 | Laser processing method | — | 2022-03-29 |
| 11069543 | Laminate processing method | — | 2021-07-20 |
| 11056361 | Laminate processing method | — | 2021-07-06 |