Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374587 | Method of processing workpiece | Yihui Lee | 2025-07-29 |
| 12354902 | Wafer processing method | Shigenori Harada | 2025-07-08 |
| 12300544 | Expanding method and expanding apparatus | Takayuki Masada | 2025-05-13 |
| 11569129 | Workpiece processing method | Yoshiaki Yodo | 2023-01-31 |
| 11348797 | Stacked wafer processing method | Shigenori Harada, Yoshiaki Yodo, Koji Watanabe | 2022-05-31 |
| 11325804 | Tape attaching method | Shigenori Harada | 2022-05-10 |
| 11315821 | Processing method for wafer | — | 2022-04-26 |
| 11315833 | Wafer processing method including a test element group (TEG) cutting step | — | 2022-04-26 |
| 11158541 | Method of processing wafer | — | 2021-10-26 |
| 10879122 | Wafer processing method | Shigenori Harada, Takashi Okamura | 2020-12-29 |
| 10804154 | Wafer processing method | — | 2020-10-13 |
| 10515840 | Expanding method and expanding apparatus | Yoshiaki Yodo | 2019-12-24 |
| 10468255 | Wafer processing method | — | 2019-11-05 |
| 8753923 | Wafer processing method | Satoshi Kobayashi | 2014-06-17 |