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Yoshiaki Yodo — 49 Patents

DIDisco: 49 patents #7 of 708Top 1%
Overall (All Time): #56,194 of 4,157,543Top 2%
49 Patents All Time

Issued Patents All Time

Showing 26–49 of 49 patents

Patent #TitleCo-InventorsDate
11049757 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-29
11043421 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-22
11037814 Wafer processing method using a ring frame with a polyester sheet with no adhesive layer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-15
11037813 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-15
11031234 Wafer processing method including applying a polyolefin sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-08
11024543 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-06-01
11018058 Wafer processing method for dividing a wafer along predefined division lines using polyester sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-05-25
11018043 Wafer processing method using a ring frame and a polyester sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-05-25
11011407 Wafer processing method using a ring frame and a polyolefin sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-05-18
11004744 Wafer processing method for dividing a wafer along predefined division lines Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-05-11
10998232 Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-05-04
10991624 Wafer processing method including applying a polyolefin sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-04-27
10991587 Wafer processing method including applying a polyester sheet to a wafer Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-04-27
10985067 Wafer processing method using a laser beam dividing step Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-04-20
10985066 Wafer processing method for dividing a wafer along division lines Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-04-20
10910269 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-02-02
10896850 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2021-01-19
10847420 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2020-11-24
10720355 Wafer processing method Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more 2020-07-21
10515840 Expanding method and expanding apparatus Jinyan Zhao 2019-12-24
10265805 Method of processing workpiece 2019-04-23
9449878 Wafer processing method 2016-09-20
9093519 Wafer processing method Yohei Yamashita, Kenji Furuta 2015-07-28
9054179 Wafer processing method Chikara Aikawa, Kunimitsu Takahashi, Nobuyasu Kitahara, Seiji Fujiwara, Junichi Kuki 2015-06-09