Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114342 | Wafer processing method | — | 2021-09-07 |
| 10629487 | Wafer dividing method | — | 2020-04-21 |
| 7439162 | Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform | Tadato Nagasawa, Takatoshi Masuda | 2008-10-21 |