Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7278206 | Method of preparing terminal board | Kazuhisa Arai | 2007-10-09 |
| 6676491 | Semiconductor wafer dividing method | Kazuhisa Arai, Masaya Takeuchi, Hiromi Hayashi | 2004-01-13 |
| 6500047 | Semiconductor wafer cutting machine | Kazuhisa Arai, Masaya Takeuchi | 2002-12-31 |