HM

Hiroshi Morikazu

DI Disco: 95 patents #2 of 708Top 1%
OU Osaka University: 1 patents #681 of 1,984Top 35%
Overall (All Time): #16,029 of 4,157,543Top 1%
95
Patents All Time

Issued Patents All Time

Showing 76–95 of 95 patents

Patent #TitleCo-InventorsDate
7932478 Laser processing machine Keiji Nomaru, Taiki Sawabe 2011-04-26
7919395 Method for separating wafer using two laser beams 2011-04-05
7919725 Via hole forming method 2011-04-05
7842902 Laser processing method and laser beam processing machine Masahiro Murata 2010-11-30
7767550 Wafer laser processing method and laser processing equipment 2010-08-03
7754582 Laser processing method Shinichiro Uemura 2010-07-13
7732729 Laser processing device Yutaka Kobayashi, Kouichi Nehashi 2010-06-08
7675002 Laser beam processing machine Keiji Nomaru, Yasuomi Kaneuchi 2010-03-09
7642485 Laser beam processing machine Noboru Takeda, Satoshi Genda, Yukio Morishige 2010-01-05
7629229 Laser processing method 2009-12-08
7618892 Via hole forming method 2009-11-17
7601616 Wafer laser processing method Ryugo Oba, Yukio Morishige, Toshio Tsuchiya, Koji Yamaguchi 2009-10-13
7589332 Via-hole processing method Keiji Nomaru 2009-09-15
7569840 Alignment method of a laser beam processing machine Eri Kawagishi 2009-08-04
7557904 Wafer holding mechanism Naoki Ohmiya, Satoshi Genda, Noboru Takeda, Koichi Takeyama, Yukio Morishige +1 more 2009-07-07
7473866 Laser processing apparatus Yukio Morishige, Toshio Tsuchiya, Koichi Takeyama 2009-01-06
7471384 Via hole depth detector Keiji Nomaru, Yasuomi Kaneuchi, Kouichi Nehashi, Yutaka Kobayashi 2008-12-30
7408129 Laser beam machine with cylindrical lens system Toshio Tsuchiya, Tomoaki Endo, Koichi Takeyama 2008-08-05
7368682 Processing apparatus 2008-05-06
7355157 Laser beam processing machine employing two beam spots having arcuate portions for forming a substantially rectangular combined spot 2008-04-08