Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11433487 | Method of processing workpiece | Andy Sher | 2022-09-06 |
| 9530695 | Wafer processing method | Tsutomu Maeda | 2016-12-27 |
| 7915140 | Fabrication method for device having die attach film on the back side thereof | Nobuyasu Kitahara | 2011-03-29 |
| 7642485 | Laser beam processing machine | Noboru Takeda, Hiroshi Morikazu, Yukio Morishige | 2010-01-05 |
| 7557904 | Wafer holding mechanism | Naoki Ohmiya, Noboru Takeda, Koichi Takeyama, Yukio Morishige, Hiroshi Morikazu +1 more | 2009-07-07 |
| 7544588 | Laser processing method for wafer | — | 2009-06-09 |
| 7459378 | Wafer dividing method | Hiroshi Nakamura | 2008-12-02 |
| 7179723 | Wafer processing method | Toshiyuki Yoshikawa, Ryugo Oba, Kenji Furuta, Nobuyasu Kitahara | 2007-02-20 |
| 7087857 | Method of dividing a workpiece in the form of a plate having a layer and a substrate made of different materials | Masaru Nakamura, Toshiyuki Yoshikawa | 2006-08-08 |