Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7602071 | Apparatus for dividing an adhesive film mounted on a wafer | Kentaro Iizuka, Yusuke Nagai | 2009-10-13 |
| 7557904 | Wafer holding mechanism | Satoshi Genda, Noboru Takeda, Koichi Takeyama, Yukio Morishige, Hiroshi Morikazu +1 more | 2009-07-07 |
| 7449396 | Wafer dividing method | Masahiro Murata, Yusuke Nagai, Yukio Morishige, Satoshi Kobayashi | 2008-11-11 |
| 7265033 | Laser beam processing method for a semiconductor wafer | Koichi Shigematsu, Toshiyuki Yoshikawa | 2007-09-04 |
| 7179722 | Wafer dividing method | Masahiro Murata, Yusuke Nagai, Yukio Morishige, Satoshi Kobayashi | 2007-02-20 |
| 7063083 | Wafer dividing method and apparatus | Yusuke Nagai, Masaru Nakamura | 2006-06-20 |
| 6726526 | Cutting machine | Kazuma Sekiya | 2004-04-27 |
| 6010396 | Blade cover in a cutting apparatus | — | 2000-01-04 |