Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312512 | Adhesive sheet for backgrinding and production method for semiconductor wafer | Karl Heinz Priewasser, Tomoyuki Kanai, Takeshi Saito | 2025-05-27 |
| 12243766 | Back grinding adhesive sheet, and method for manufacturing semiconductor wafer | Karl Heinz Priewasser, Tomoyuki Kanai, Takeshi Saito | 2025-03-04 |
| 9963622 | Heat-resistant adhesive sheet for semiconductor testing | Gosuke Nakajima | 2018-05-08 |
| 9934997 | Adhesive sheet and method of manufacturing electronic component | Gosuke Nakajima | 2018-04-03 |