Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312512 | Adhesive sheet for backgrinding and production method for semiconductor wafer | Karl Heinz Priewasser, Tomoya Tsukui, Takeshi Saito | 2025-05-27 |
| 12243766 | Back grinding adhesive sheet, and method for manufacturing semiconductor wafer | Karl Heinz Priewasser, Tomoya Tsukui, Takeshi Saito | 2025-03-04 |
| 9061485 | Method of manufacturing translucent rigid substrate laminate | Hiroyuki Kurimura, Isamu Ichikawa, Gosuke Nakajima, Hayato Miyazaki, Yasunori Hayashi +1 more | 2015-06-23 |
| 8859633 | Adherent composition and method of temporarily fixing member therewith | Kazuhiro Oshima, Kunio Iriuchijima | 2014-10-14 |
| 8415425 | Curable resin composition, surface protection method, temporary fixation method, and separation method | Kazuhiro Oshima | 2013-04-09 |
| 8338526 | Curable resin composition, surface protection method, temporary fixation method, and separation method | Kazuhiro Oshima | 2012-12-25 |
| 8313604 | Curable composition and temporary fixation method of member using it | Kazuhiro Oshima | 2012-11-20 |
| 8187411 | Adherent composition and method of temporarily fixing member therewith | Kazuhiro Oshima, Kunio Iriuchijima | 2012-05-29 |
| 8048258 | Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereof | Hiroyuki Kurimura, Kazuhiro Oshima | 2011-11-01 |
| 7988811 | Adhesive composition and method for temporarily fixing member by using the same | Hiroyuki Kurimura, Kazuhiro Oshima | 2011-08-02 |