Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10702946 | Substrate processing method | Hiroshi Morikazu, Nao Hattori | 2020-07-07 |
| 10682728 | Method of processing a substrate | Hitoshi Hoshino, Kenji Furuta | 2020-06-16 |
| 10475676 | Workpiece processing method | Akiko Kigawa | 2019-11-12 |
| 10319593 | Wafer thinning method | Kazuya Hirata, Yoko Nishino, Hiroshi Morikazu | 2019-06-11 |
| 10312099 | Wafer processing method | Kazuma Sekiya | 2019-06-04 |
| 10256148 | Method of processing wafer | — | 2019-04-09 |
| 10242913 | Method of processing a wafer and wafer processing system | Hitoshi Hoshino | 2019-03-26 |
| 10032669 | Wafer dividing method | — | 2018-07-24 |
| 9935010 | Method of processing a wafer and wafer processing system | Hitoshi Hoshino | 2018-04-03 |
| 9905453 | Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing method | — | 2018-02-27 |
| 9831128 | Method of processing a substrate | Hiroshi Morikazu, Nao Hattori | 2017-11-28 |
| 9768049 | Support plate and method for forming support plate | — | 2017-09-19 |
| 9704749 | Method of dividing wafer into dies | — | 2017-07-11 |
| 9595463 | Wafer processing method | — | 2017-03-14 |
| 9472442 | Wafer processing method | — | 2016-10-18 |
| 9437439 | Processing method for wafer having chamfered portion along the outer circumference thereof followed by thinning and separating | — | 2016-09-06 |
| 9397000 | Wafer processing method | — | 2016-07-19 |
| 9006085 | Adhesive and protective member used in a wafer processing method | — | 2015-04-14 |
| 8828803 | Resin sealing method for semiconductor chips | — | 2014-09-09 |
| 8815644 | Wafer processing method | — | 2014-08-26 |
| 8026153 | Wafer processing method | — | 2011-09-27 |
| 7708855 | Method for processing a semiconductor wafer | — | 2010-05-04 |
| 7520309 | Method for adhering protecting tape of wafer and adhering apparatus | — | 2009-04-21 |
| 7413501 | Method for concave grinding of wafer and unevenness-absorbing pad | — | 2008-08-19 |
| 7115485 | Method for processing wafer | — | 2006-10-03 |