Issued Patents All Time
Showing 101–115 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5926715 | Method of forming lightly-doped drain by automatic PSG doping | Der-Tsyr Fan, Jr-Min Tsaur | 1999-07-20 |
| 5909621 | Single-side corrugated cylindrical capacitor structure of high density DRAMs | Thomas Chang | 1999-06-01 |
| 5858867 | Method of making an inverse-T tungsten gate | Thomas Chang | 1999-01-12 |
| 5851898 | Method of forming stacked capacitor having corrugated side-wall structure | Thomas Chang | 1998-12-22 |
| 5843822 | Double-side corrugated cylindrical capacitor structure of high density DRAMs | Thomas Chang | 1998-12-01 |
| 5827780 | Additive metalization using photosensitive polymer as RIE mask and part of composite insulator | Thomas Chang | 1998-10-27 |
| 5827783 | Stacked capacitor having improved charge storage capacity | Thomas Chang | 1998-10-27 |
| 5789267 | Method of making corrugated cell contact | Thomas Chang | 1998-08-04 |
| 5701013 | Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements | Thomas Chang | 1997-12-23 |
| 5672243 | Antireflection coating for highly reflective photolithographic layers comprising chromium oxide or chromium suboxide | Thomas Chang | 1997-09-30 |
| 5633522 | CMOS transistor with two-layer inverse-T tungsten gate | Fernand Dorleans, Louis L. Hsu, Gerald R. Larsen, Geraldine C. Schwartz | 1997-05-27 |
| 5599725 | Method for fabricating a MOS transistor with two-layer inverse-T tungsten gate structure | Fernand Dorleans, Louis L. Hsu, Gerald R. Larsen, Geraldine C. Schwartz | 1997-02-04 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |
| 4932883 | Elastomeric connectors for electronic packaging and testing | Thomas P. McAndrew, Fred Stuebner | 1990-06-12 |