Issued Patents All Time
Showing 76–87 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6188135 | Copper interconnect with top barrier layer | Lap Chan | 2001-02-13 |
| 6187093 | Apparatus and method for planarization of spin-on materials | — | 2001-02-13 |
| 6140237 | Damascene process for forming coplanar top surface of copper connector isolated by barrier layers in an insulating layer | Lap Chan | 2000-10-31 |
| 6127238 | Plasma enhanced chemical vapor deposited (PECVD) silicon nitride barrier layer for high density plasma chemical vapor deposited (HDP-CVD) dielectric layer | Marvin Liao, Kho Liep Chok, Wei-Lun LU, Yih-Shung Lin | 2000-10-03 |
| 6124215 | Apparatus and method for planarization of spin-on materials | — | 2000-09-26 |
| 6100196 | Method of making a copper interconnect with top barrier layer | Lap Chan | 2000-08-08 |
| 6069069 | Method for planarizing a low dielectric constant spin-on polymer using nitride etch stop | Simon Chooi, Lap Chan | 2000-05-30 |
| 5948700 | Method of planarization of an intermetal dielectric layer using chemical mechanical polishing | Lap Chan | 1999-09-07 |
| 5930677 | Method for reducing microloading in an etchback of spin-on-glass or polymer | Guo Li Qi Mike, Yi Xu | 1999-07-27 |
| 5900672 | Barrier layer | Lap Chan | 1999-05-04 |
| 5744376 | Method of manufacturing copper interconnect with top barrier layer | Lap Chan | 1998-04-28 |
| 5728621 | Method for shallow trench isolation | Charlie Tay, Wei Lu, Lap Chan | 1998-03-17 |