PR

Pradip K. Roy

AT AT&T: 46 patents #270 of 18,772Top 2%
AG Agere Systems Guardian: 42 patents #1 of 810Top 1%
AS Agere Systems: 24 patents #24 of 1,849Top 2%
NE Nexplanar: 9 patents #5 of 16Top 35%
GL General Foods Limited: 4 patents #59 of 659Top 9%
KE Kellogg: 4 patents #34 of 236Top 15%
TL Tokyo Electron Limited: 1 patents #3,538 of 5,567Top 65%
KF Kraft General Foods: 1 patents #132 of 377Top 40%
AB Apv Baker: 1 patents #2 of 21Top 10%
SC S.E.S. Co.: 1 patents #14 of 24Top 60%
CM Cabot Microelectronics: 1 patents #131 of 207Top 65%
MIT: 1 patents #4,386 of 9,367Top 50%
📍 Orlando, FL: #3 of 4,387 inventorsTop 1%
🗺 Florida: #77 of 67,251 inventorsTop 1%
Overall (All Time): #7,284 of 4,157,543Top 1%
139
Patents All Time

Issued Patents All Time

Showing 26–50 of 139 patents

Patent #TitleCo-InventorsDate
6670242 Method for making an integrated circuit device including a graded, grown, high quality gate oxide layer and a nitride layer David C. Brady, Yi Ma 2003-12-30
6664800 Non-contact method for determining quality of semiconductor dielectrics Carlos M. Chacon, Sundar Srinivasan Chetlur 2003-12-16
6659846 Pad for chemical mechanical polishing Sudhanshu Misra 2003-12-09
6616965 Non-hydrolytic-sol-gel process for high K dielectric Sudhanshu Misra 2003-09-09
6605529 Method of creating hydrogen isotope reservoirs in a semiconductor device Sundar Srinivasan Chetlur, Jennifer M. McKinley, Minesh Patel, Jonathan Zhou 2003-08-12
6599837 Chemical mechanical polishing composition and method of polishing metal layers using same Sailesh Mansinh Merchant, Sudhanshu Misra 2003-07-29
6576522 Methods for deuterium sintering Sundar Srinivasan Chetlur, Minesh Patel, Sidhartha Sen, Vivek Saxena 2003-06-10
6552381 Trench capacitors in SOI substrates Sailesh Chittipeddi, Charles Walter Pearce 2003-04-22
6551946 TWO-STEP OXIDATION PROCESS FOR OXIDIZING A SILICON SUBSTRATE WHEREIN THE FIRST STEP IS CARRIED OUT AT A TEMPERATURE BELOW THE VISCOELASTIC TEMPERATURE OF SILICON DIOXIDE AND THE SECOND STEP IS CARRIED OUT AT A TEMPERATURE ABOVE THE VISCOELASTIC TEMPERATURE Yuanning Chen, Sundar Srinivasan Chetlur 2003-04-22
6548422 Method and structure for oxide/silicon nitride interface substructure improvements David C. Brady, Carlos M. Chacon 2003-04-15
6548854 Compound, high-K, gate and capacitor insulator layer Isik C. Kizilyalli, Yi Ma 2003-04-15
6544107 Composite polishing pads for chemical-mechanical polishing Sudhanshu Misra 2003-04-08
6541394 Method of making a graded grown, high quality oxide layer for a semiconductor device Yuanning Chen, Sailesh Mansinh Merchant 2003-04-01
6540974 Process for making mixed metal oxides Sudhanshu Misra 2003-04-01
6535014 Electrical parameter tester having decoupling means Sundar Srinivasan Chetlur 2003-03-18
6524957 Method of forming in-situ electroplated oxide passivating film for corrosion inhibition Sailesh Mansinh Merchant, Sudhanshu Misra 2003-02-25
6495875 Method of forming metal oxide metal capacitors using multi-step rapid material thermal process and a device formed thereby Siddhartha Bhowmik, Sailesh Mansinh Merchant, Sidhartha Sen 2002-12-17
6492712 High quality oxide for use in integrated circuits Yuanning Chen, Sundar Srinivasan Chetlur, Sailesh Mansinh Merchant 2002-12-10
6471925 Method for treating an effluent gas during semiconductor processing Sailesh Mansinh Merchant, Sudhanshu Misra 2002-10-29
6461225 Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP) Sudhanshu Misra 2002-10-08
6458016 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method Sailesh Mansinh Merchant, Sudhanshu Misra, Hem M. Vaidya 2002-10-01
6458289 CMP slurry for polishing semiconductor wafers and related methods Sailesh Mansinh Merchant, Sudhanshu Misra 2002-10-01
6439972 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method Sudhanshu Misra, Sundar Chetlur, Vivek Saxena 2002-08-27
6440829 N-profile engineering at the poly/gate oxide and gate oxide/SI interfaces through NH3 annealing of a layered poly/amorphous-silicon structure Yi Ma, Michael Laughery 2002-08-27
6440849 Microstructure control of copper interconnects Sailesh Mansinh Merchant 2002-08-27