Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8133368 | Encapsulated sputtering target | Lara Hawrylchak, Xianmin Tang, Vijay Parhke | 2012-03-13 |
| 8129280 | Substrate device having a tuned work function and methods of forming thereof | Xianmin Tang, Dengliang Yang, Zhendong Liu, Srinivas Gandikota | 2012-03-06 |
| 8119525 | Process for selective growth of films during ECP plating | Jick Yu, Wei Wang, Hua Chung | 2012-02-21 |
| 7737028 | Selective ruthenium deposition on copper materials | Hua Chung, Jick Yu, Praburam Gopalraja | 2010-06-15 |
| 7691742 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Christophe Marcadal, Hua Chung, Nirmalya Maity | 2010-04-06 |
| 7659204 | Oxidized barrier layer | Xianmin Tang, Hua Chung, Praburam Gopalraja, Jick Yu, Jenn-Yue Wang | 2010-02-09 |
| 7595263 | Atomic layer deposition of barrier materials | Hua Chung, Nirmalya Maity | 2009-09-29 |
| 7524762 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Christophe Marcadal, Hua Chung, Nirmalya Maity | 2009-04-28 |
| 7241686 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Christophe Marcadal, Hua Chung, Nirmalya Maity | 2007-07-10 |
| 7211508 | Atomic layer deposition of tantalum based barrier materials | Hua Chung, Nirmalya Maity | 2007-05-01 |