Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Jeffrey L. Franklin +1 more | 2022-02-22 |
| 11211439 | Stretchable polymer and dielectric layers for electronic displays | Byung Sung Kwak, Robert Jan Visser | 2021-12-28 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kurtis Leschkies, Roman Gouk +2 more | 2021-03-02 |
| 10886232 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2021-01-05 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Roman Gouk, Chintan Buch, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio | 2020-07-28 |
| 10547040 | Energy storage device having an interlayer between electrode and electrolyte layer | Giback Park, Byung Sung Kwak, Lizhong Sun, Dimitrios Argyris, Miaojun Wang | 2020-01-28 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu +3 more | 2019-02-19 |