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Kam S. Law, Masato Toshima, Wendell T. Blonigan, Robin Law |
2013-12-31 |
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Lifting mechanism for integrated circuit fabrication systems |
Masato Toshima, Jay C. Cho |
2005-03-01 |
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Conditioner assembly and a conditioner back support for a chemical mechanical polishing apparatus |
Ethan C. Wilson, James A. Allen, David E. Weldon, Gregory C. Lee, Jeffrey M. L. Fontana +2 more |
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Polishing pad shaping and patterning |
Tsungnan Cheng, Ethan C. Wilson, Shou-Sung Chang, Gregory C. Lee, Huey-Ming Tzeng +3 more |
2001-11-13 |
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Retaining ring for wafer polishing |
David E. Weldon, Shu-Hsin Kao, Michael A. Leach, Charles J. Regan |
2001-07-31 |
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Wafer polishing head drive |
Kelvin Lum, Gregory A. Appel |
2000-05-16 |
| 6042457 |
Conditioner assembly for a chemical mechanical polishing apparatus |
Ethan C. Wilson, James A. Allen, David E. Weldon, Gregory C. Lee, Jeffrey M. L. Fontana +2 more |
2000-03-28 |
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Modular wafer polishing apparatus and method |
H. Alexander Anderson, Tsungnan Cheng, Garry K. Kwong, Albert Hu, David Z. Chen +1 more |
1999-09-28 |