Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8322030 | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns | Ronald Patrick Huemoeller | 2012-12-04 |
| 8323771 | Straight conductor blind via capture pad structure and fabrication method | Ronald Patrick Huemoeller | 2012-12-04 |
| 8298866 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2012-10-30 |
| 8176628 | Protruding post substrate package structure and method | Ronald Patrick Huemoeller, David Jon Hiner | 2012-05-15 |
| 8119455 | Wafer level package fabrication method | Ronald Patrick Huemoeller, David Razu | 2012-02-21 |
| 8110909 | Semiconductor package including top-surface terminals for mounting another semiconductor package | David Jon Hiner, Ronald Patrick Huemoeller | 2012-02-07 |
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package | David Jon Hiner, Ronald Patrick Huemoeller | 2011-09-27 |
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Bob Shih-Wei Kuo, Jon Aday, Lee Smith, Robert Francis Darveaux | 2011-09-13 |
| 7977163 | Embedded electronic component package fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2011-07-12 |
| 7958626 | Embedded passive component network substrate fabrication method | Nozad Karim, Ronald Patrick Huemoeller | 2011-06-14 |
| 7951697 | Embedded die metal etch stop fabrication method and structure | Ronald Patrick Huemoeller | 2011-05-31 |
| 7932595 | Electronic component package comprising fan-out traces | Ronald Patrick Huemoeller, David Razu | 2011-04-26 |
| 7923645 | Metal etch stop fabrication method and structure | Ronald Patrick Huemoeller, Robert Francis Darveaux | 2011-04-12 |
| 7911037 | Method and structure for creating embedded metal features | Ronald Patrick Huemoeller, David Jon Hiner, Nozad Karim | 2011-03-22 |
| 7842541 | Ultra thin package and fabrication method | Ronald Patrick Huemoeller, Bob Shih-Wei Kuo, Lee Smith | 2010-11-30 |
| 7832097 | Shielded trace structure and fabrication method | Ronald Patrick Huemoeller, Nozad Karim | 2010-11-16 |
| 7752752 | Method of fabricating an embedded circuit pattern | Ronald Patrick Huemoeller | 2010-07-13 |
| 7714431 | Electronic component package comprising fan-out and fan-in traces | Ronald Patrick Huemoeller, David Razu | 2010-05-11 |
| 7671457 | Semiconductor package including top-surface terminals for mounting another semiconductor package | David Jon Hiner, Ronald Patrick Huemoeller | 2010-03-02 |
| 7670962 | Substrate having stiffener fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2010-03-02 |
| 7632753 | Wafer level package utilizing laser-activated dielectric material | Bob Shih-Wei Kuo, Ronald Patrick Huemoeller | 2009-12-15 |
| 7589398 | Embedded metal features structure | Ronald Patrick Huemoeller, David Jon Hiner, Nozad Karim | 2009-09-15 |
| 7572681 | Embedded electronic component package | Ronald Patrick Huemoeller, David Jon Hiner | 2009-08-11 |
| 7548430 | Buildup dielectric and metallization process and semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2009-06-16 |
| 7501338 | Semiconductor package substrate fabrication method | Ronald Patrick Huemoeller, David Jon Hiner, Richard P. Sheridan | 2009-03-10 |