Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7399661 | Method for making an integrated circuit substrate having embedded back-side access conductors and vias | David Jon Hiner, Ronald Patrick Huemoeller | 2008-07-15 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2008-04-29 |
| 7361533 | Stacked embedded leadframe | Ronald Patrick Huemoeller, David Jon Hiner | 2008-04-22 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns | Ronald Patrick Huemoeller | 2007-12-25 |
| 7297562 | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns | Ronald Patrick Huemoeller | 2007-11-20 |
| 7192807 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2007-03-20 |
| 7190062 | Embedded leadframe semiconductor package | Richard P. Sheridan, Ronald Patrick Huemoeller, David Jon Hiner | 2007-03-13 |
| 7185426 | Method of manufacturing a semiconductor package | David Jon Hiner, Ronald Patrick Huemoeller | 2007-03-06 |
| 7145238 | Semiconductor package and substrate having multi-level vias | Ronald Patrick Huemoeller, David Jon Hiner | 2006-12-05 |
| 7028400 | Integrated circuit substrate having laser-exposed terminals | David Jon Hiner, Ronald Patrick Huemoeller | 2006-04-18 |
| 6967124 | Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate | Ronald Patrick Huemoeller | 2005-11-22 |
| 6930256 | Integrated circuit substrate having laser-embedded conductive patterns and method therefor | Ronald Patrick Huemoeller | 2005-08-16 |
| 6930257 | Integrated circuit substrate having laminated laser-embedded circuit layers | David Jon Hiner, Ronald Patrick Huemoeller | 2005-08-16 |
| 6905914 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2005-06-14 |
| 6831371 | Integrated circuit substrate having embedded wire conductors and method therefor | Ronald Patrick Huemoeller | 2004-12-14 |
| 6784376 | Solderable injection-molded integrated circuit substrate and method therefor | Ronald Patrick Huemoeller | 2004-08-31 |
| 6747352 | Integrated circuit having multiple power/ground connections to a single external terminal | Ronald Patrick Huemoeller, David Jon Hiner | 2004-06-08 |
| 6534391 | Semiconductor package having substrate with laser-formed aperture through solder mask layer | Ronald Patrick Huemoeller | 2003-03-18 |
| 5861076 | Method for making multi-layer circuit boards | Edwin J. Adlam, Jordan L. Wahl, Tayfun Ilercil, Robert Forcier, Jerome S. Sallo | 1999-01-19 |