Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6562655 | Heat spreader with spring IC package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Thomas P. Glenn, Roy Dale Hollaway | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Thomas P. Glenn, Roy Dale Hollaway | 2003-04-08 |
| 6532157 | Angulated semiconductor packages | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-11 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-11 |
| 6528875 | Vacuum sealed package for semiconductor chip | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-04 |
| 6528857 | Chip size image sensor bumped package | Thomas P. Glenn, Markus K. Liebhard | 2003-03-04 |
| 6526653 | Method of assembling a snap lid image sensor package | Thomas P. Glenn | 2003-03-04 |
| 6522015 | Micromachine stacked wirebonded package | Thomas P. Glenn, Roy Dale Hollaway | 2003-02-18 |
| 6515269 | Integrally connected image sensor packages having a window support in contact with a window and the active area | Tony Arellano, Roy Dale Hollaway | 2003-02-04 |
| 6512219 | Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area | Tony Arellano, Roy Dale Hollaway | 2003-01-28 |
| 6509560 | Chip size image sensor in wirebond package with step-up ring for electrical contact | Thomas P. Glenn, Markus K. Liebhard | 2003-01-21 |
| 6503780 | Wafer scale image sensor package fabrication method | Thomas P. Glenn, Tony Arellano | 2003-01-07 |
| 6492699 | Image sensor package having sealed cavity over active area | Thomas P. Glenn | 2002-12-10 |
| 6486545 | Pre-drilled ball grid array package | Thomas P. Glenn, Roy Dale Hollaway | 2002-11-26 |
| 6483101 | Molded image sensor package having lens holder | — | 2002-11-19 |
| 6483030 | Snap lid image sensor package | Thomas P. Glenn | 2002-11-19 |
| 6455774 | Molded image sensor package | — | 2002-09-24 |
| 6455927 | Micromirror device package | Thomas P. Glenn, Roy Dale Hollaway | 2002-09-24 |
| 6448506 | Semiconductor package and circuit board for making the package | Thomas P. Glenn, Roy D. Holloway | 2002-09-10 |
| 6441503 | Bond wire pressure sensor die package | — | 2002-08-27 |
| 6441504 | Precision aligned and marked structure | Thomas P. Glenn, Gary L. Swiss | 2002-08-27 |
| 6432737 | Method for forming a flip chip pressure sensor die package | — | 2002-08-13 |
| 6429513 | Active heat sink for cooling a semiconductor chip | Charles A. Shermer, IV, Thomas P. Glenn, Donald C. Foster | 2002-08-06 |
| 6424315 | Semiconductor chip having a radio-frequency identification transceiver | Thomas P. Glenn | 2002-07-23 |