Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784534 | Thin integrated circuit package having an optically transparent window | Thomas P. Glenn, Vincent Di Caprio | 2004-08-31 |
| 6777789 | Mounting for a package containing a chip | Thomas P. Glenn, Roy Dale Hollaway | 2004-08-17 |
| 6734419 | Method for forming an image sensor package with vision die in lens housing | Thomas P. Glenn, Roy Dale Hollaway | 2004-05-11 |
| 6730536 | Pre-drilled image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2004-05-04 |
| 6717126 | Method of fabricating and using an image sensor package with reflector | Thomas P. Glenn, Roy Dale Hollaway | 2004-04-06 |
| 6686580 | Image sensor package with reflector | Thomas P. Glenn, Roy Dale Hollaway | 2004-02-03 |
| 6686588 | Optical module with lens integral holder | Thomas P. Glenn, Roy Dale Hollaway | 2004-02-03 |
| 6672773 | Optical fiber having tapered end and optical connector with reciprocal opening | Thomas P. Glenn | 2004-01-06 |
| 6670698 | Integrated circuit package mounting | Thomas P. Glenn, Roy Dale Hollaway | 2003-12-30 |
| 6661080 | Structure for backside saw cavity protection | Thomas P. Glenn, Roy Dale Hollaway | 2003-12-09 |
| 6638789 | Micromachine stacked wirebonded package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-10-28 |
| 6629633 | Chip size image sensor bumped package fabrication method | Thomas P. Glenn, Markus K. Liebhard | 2003-10-07 |
| 6627987 | Ceramic semiconductor package and method for fabricating the package | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-30 |
| 6627864 | Thin image sensor package | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-30 |
| 6624921 | Micromirror device package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-23 |
| 6620646 | Chip size image sensor wirebond package fabrication method | Thomas P. Glenn, Markus K. Liebhard | 2003-09-16 |
| 6610167 | Method for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-08-26 |
| 6586826 | Integrated circuit package having posts for connection to other packages and substrates | Thomas P. Glenn, Steven M. Anderson | 2003-07-01 |
| 6586824 | Reduced thickness packaged electronic device | Thomas P. Glenn, Roy Dale Hollaway | 2003-07-01 |
| 6580153 | Structure for protecting a micromachine with a cavity in a UV tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-17 |
| 6580167 | Heat spreader with spring IC package | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-17 |
| 6577013 | Chip size semiconductor packages with stacked dies | Thomas P. Glenn, Vincent DiCaprio | 2003-06-10 |
| 6571466 | Flip chip image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-03 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-03 |
| 6564454 | Method of making and stacking a semiconductor package | Thomas P. Glenn, Roy D. Holloway | 2003-05-20 |