Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592197 | Image sensor chip package fabrication method | Ying-Cheng Wu, Kun-Hsieh Liu | 2009-09-22 |
| 7554184 | Image sensor chip package | Ying-Cheng Wu | 2009-06-30 |
| 7540672 | Digital still camera module | Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu | 2009-06-02 |
| 7538862 | Testing system for digital camera modules | Ying-Cheng Wu, Yuan-Po Wang | 2009-05-26 |
| 7460317 | Digital camera module with improved image quality | Ying-Cheng Wu, Ching-Lung Jao | 2008-12-02 |
| 7425750 | Snap lid camera module | Thomas P. Glenn | 2008-09-16 |
| 7417327 | IC chip package with cover | Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu | 2008-08-26 |
| 7408205 | Digital camera module | Ying-Cheng Wu | 2008-08-05 |
| 7365421 | IC chip package with isolated vias | Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu | 2008-04-29 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board | — | 2008-04-22 |
| 7342215 | Digital camera module package fabrication method | Ying-Cheng Wu, Kun-Hsieh Liu | 2008-03-11 |
| 7332712 | Camera module fabrication method including the step of removing a lens mount and window from the mold | — | 2008-02-19 |
| 7199359 | Camera module fabrication method including singulating a substrate | — | 2007-04-03 |
| 7126111 | Camera module having a threaded lens barrel and a ball grid array connecting device | — | 2006-10-24 |
| 7107519 | Spreadsheet-based user interface creation | Robb Robles, E. John McGarry, Russ Weinzimmer | 2006-09-12 |
| 7059040 | Optical module with lens integral holder fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2006-06-13 |
| 6967395 | Mounting for a package containing a chip | Thomas P. Glenn, Roy Dale Hollaway | 2005-11-22 |
| 6956201 | Image sensor package fabrication method | — | 2005-10-18 |
| 6946316 | Method of fabricating and using an image sensor package | Thomas P. Glenn | 2005-09-20 |
| 6943429 | Wafer having alignment marks extending from a first to a second surface of the wafer | Thomas P. Glenn, Roy Dale Hollaway | 2005-09-13 |
| 6875379 | Tool and method for forming an integrated optical circuit | Thomas P. Glenn | 2005-04-05 |
| 6869861 | Back-side wafer singulation method | Thomas P. Glenn, Roy Dale Hollaway | 2005-03-22 |
| 6849916 | Flip chip on glass sensor package | Thomas P. Glenn, Roy Dale Hollaway | 2005-02-01 |
| 6816523 | VCSEL package and fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2004-11-09 |
| 6791076 | Image sensor package | — | 2004-09-14 |