Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11991185 | Method for secure data transmission and system using the same | Yuan Chen Chan, Chun-Hsien Tsai | 2024-05-21 |
| 11611409 | Communication system and communication method for reporting compromised state in one-way transmission | Yuan Chen Chan | 2023-03-21 |
| 11575652 | Communication system and communication method for one-way transmission | Yuan Chen Chan | 2023-02-07 |
| 11539756 | Switch device for one-way transmission | Yuan Chen Chan | 2022-12-27 |
| 11496233 | Communication system and communication method for one-way transmission | Yuan Chen Chan, Po-Hao Su | 2022-11-08 |
| 11477048 | Communication method for one-way transmission based on VLAN ID and switch device using the same | Yuan Chen Chan | 2022-10-18 |
| 10573776 | Manufacturing method of image-sensing module | Shin-Dar Jan | 2020-02-25 |
| 9432558 | Image capturing module having a built-in dustproof structure | Kuo-Hao Peng | 2016-08-30 |
| 9225887 | Image capturing module for reducing assembly tilt | Chao-Yuan Chan | 2015-12-29 |
| 9154670 | Image capturing module having a built-in topmost dustproof structure | Kuo-Hao Peng | 2015-10-06 |
| 7643081 | Digital camera module with small sized image sensor chip package | Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu | 2010-01-05 |
| 7540672 | Digital still camera module | Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu | 2009-06-02 |
| 7417327 | IC chip package with cover | Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu | 2008-08-26 |
| 7365421 | IC chip package with isolated vias | Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu | 2008-04-29 |