Issued Patents All Time
Showing 126–136 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6420201 | Method for forming a bond wire pressure sensor die package | — | 2002-07-16 |
| 6420776 | Structure including electronic components singulated using laser cutting | Thomas P. Glenn, Roy Dale Hollaway | 2002-07-16 |
| 6406934 | Wafer level production of chip size semiconductor packages | Thomas P. Glenn, Vincent DiCaprio | 2002-06-18 |
| 6407381 | Wafer scale image sensor package | Thomas P. Glenn, Tony Arellano | 2002-06-18 |
| 6399418 | Method for forming a reduced thickness packaged electronic device | Thomas P. Glenn, Roy Dale Hollaway | 2002-06-04 |
| 6399463 | Method of singulation using laser cutting | Thomas P. Glenn, Roy Dale Hollaway | 2002-06-04 |
| 6396043 | Thin image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2002-05-28 |
| 6389687 | Method of fabricating image sensor packages in an array | Thomas P. Glenn | 2002-05-21 |
| 6342406 | Flip chip on glass image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2002-01-29 |
| 6309943 | Precision marking and singulation method | Thomas P. Glenn, Gary L. Swiss | 2001-10-30 |
| 6266197 | Molded window array for image sensor packages | Thomas P. Glenn | 2001-07-24 |