Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410999 | Semiconductor device with integrated heat distribution and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2019-09-10 |
| 10256114 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Michael Kelly | 2019-04-09 |
| 10206285 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2019-02-12 |
| 10062611 | Encapsulated semiconductor package and method of manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2018-08-28 |
| 10034372 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2018-07-24 |
| 10008393 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2018-06-26 |
| 9960328 | Semiconductor device and manufacturing method thereof | David Clark | 2018-05-01 |
| 9905440 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Ronald Patrick Huemoeller | 2018-02-27 |
| 9741617 | Encapsulated semiconductor package and method of manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2017-08-22 |
| 9730327 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2017-08-08 |
| 9576917 | Embedded die in panel method and structure | Ronald Patrick Huemoeller, David Jon Hiner, Corey Reichman | 2017-02-21 |
| 9559075 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2017-01-31 |
| 9367712 | High density memory card using folded flex | Lee Smith, Jeffrey Alan Miks, Barry M. Miles | 2016-06-14 |
| 9012789 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2015-04-21 |
| 8704368 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2014-04-22 |
| 8623753 | Stackable protruding via package and method | Akito Yoshida, Mahmoud Dreiza | 2014-01-07 |
| 8222538 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2012-07-17 |
| 7556986 | Tape supported memory card leadframe structure | Jeffrey Alan Miks, Brenda C. Gogue | 2009-07-07 |
| 7193305 | Memory card ESC substrate insert | Jeffrey Alan Miks, Brenda C. Gogue, Stephen G. Shermer, Maximilien d'Estries | 2007-03-20 |
| 7095103 | Leadframe based memory card | Jeffrey Alan Miks, Ziehl-Neelsen L. Co | 2006-08-22 |
| 7074654 | Tape supported memory card leadframe structure | Jeffrey Alan Miks, Maximilien d'Estries, Stephen G. Shermer | 2006-07-11 |
| 6998702 | Front edge chamfer feature for fully-molded memory cards | Jeffrey Alan Miks | 2006-02-14 |
| 6897550 | Fully-molded leadframe stand-off feature | Raul Guerrero, Dae Byoung Kang, Chul-Woo Park | 2005-05-24 |