Issued Patents All Time
Showing 76–78 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5654589 | Landing pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC application | Robin Cheung, Rajat Rakkhit, Raymond T. Lee | 1997-08-05 |
| 5635423 | Simplified dual damascene process for multi-level metallization and interconnection structure | Angela T. Hui, Robin Cheung, Mark S. Chang, Ming-Ren Lin | 1997-06-03 |
| 5625231 | Low cost solution to high aspect ratio contact/via adhesion layer application for deep sub-half micrometer back-end-of line technology | Robin Cheung | 1997-04-29 |