Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541286 | Imaging of integrated circuit interconnects | Joffre F. Bernard | 2003-04-01 |
| 6518167 | Method of forming a metal or metal nitride interface layer between silicon nitride and copper | Lu You, Matthew S. Buynoski, Paul R. Besser, Jeremias D. Romero, Pin-Chin Connie Wang | 2003-02-11 |
| 6504251 | Heat/cold amorphized barrier layer for integrated circuit interconnects | Sergey Lopatin, Minh Van Ngo | 2003-01-07 |
| 6501177 | Atomic layer barrier layer for integrated circuit interconnects | Sergey Lopatin, Minh Van Ngo | 2002-12-31 |
| 6455413 | Pre-fill CMP and electroplating method for integrated circuits | Christy Mei-Chu Woo | 2002-09-24 |
| 6425991 | Plating system with secondary ring anode for a semiconductor wafer | Christy Mei-Chu Woo | 2002-07-30 |
| 6413390 | Plating system with remote secondary anode for semiconductor manufacturing | — | 2002-07-02 |
| 6402909 | Plating system with shielded secondary anode for semiconductor manufacturing | Christy Mei-Chu Woo | 2002-06-11 |
| 6348732 | Amorphized barrier layer for integrated circuit interconnects | Sergey Lopatin, Minh Van Ngo | 2002-02-19 |