Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6130169 | Efficient in-situ resist strip process for heavy polymer metal etch | King Wai Kelwin Ko, Leobardo Mercado | 2000-10-10 |
| 6127259 | Phosphoric acid process for removal of contact BARC layer | Bharath Rangarajan | 2000-10-03 |
| 6114766 | Integrated circuit with metal features presenting a larger landing area for vias | — | 2000-09-05 |
| 6087724 | HSQ with high plasma etching resistance surface for borderless vias | Khanh Tran, Robert Chen, Robert Dawson | 2000-07-11 |
| 6083850 | HSQ dielectric interlayer | — | 2000-07-04 |
| 6083851 | HSQ with high plasma etching resistance surface for borderless vias | Khanh Tran, Robert Chen, Robert Dawson | 2000-07-04 |
| 6084290 | HSQ dielectric interlayer | — | 2000-07-04 |
| 6066546 | Method to minimize particulate induced clamping failures | Anne E. Sanderfer | 2000-05-23 |
| 6060384 | Borderless vias with HSQ gap filled patterned metal layers | Robert Chen, Robert Dawson, Khanh Tran | 2000-05-09 |
| 6043147 | Method of prevention of degradation of low dielectric constant gap-fill material | Robert Chen, Robert Dawson, Khanh Tran | 2000-03-28 |
| 6010965 | Method of forming high integrity vias | — | 2000-01-04 |
| 5973387 | Tapered isolated metal profile to reduce dielectric layer cracking | Robert Chen, Khanh Tran | 1999-10-26 |
| 5958798 | Borderless vias without degradation of HSQ gap fill layers | — | 1999-09-28 |
| 5866945 | Borderless vias with HSQ gap filled patterned metal layers | Robert Chen, Robert Dawson, Khanh Tran | 1999-02-02 |