Issued Patents All Time
Showing 126–140 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476752 | Package structure for DC-DC converter | Yueh-Se Ho, Jun Lu | 2013-07-02 |
| 8472308 | Method for generating a preamble sequence and a method for determining a cyclic shift | Huanxi Tan, Peng Hao, Guanghui Yu, Junfeng Zhang | 2013-06-25 |
| 8450152 | Double-side exposed semiconductor device and its manufacturing method | Yuping Gong | 2013-05-28 |
| 8436429 | Stacked power semiconductor device using dual lead frame and manufacturing method | Yueh-Se Ho, Lei Shi, Jun Lu, Liang Zhao | 2013-05-07 |
| 8431993 | Semiconductor package for forming a leadframe package | Jun Lu, Lei Shi, Liang Zhao | 2013-04-30 |
| 8362606 | Wafer level chip scale package | Yueh-Se Ho | 2013-01-29 |
| 8344499 | Chip-exposed semiconductor device | Yuping Gong | 2013-01-01 |
| 8338232 | Power semiconductor device package method | Lei Shi, Yuping Gong | 2012-12-25 |
| 8283212 | Method of making a copper wire bond package | Jun Lu, Anup Bhalla | 2012-10-09 |
| 8247288 | Method of integrating a MOSFET with a capacitor | Anup Bhalla, Hamza Yilmaz, Jun Lu | 2012-08-21 |
| 8217503 | Package structure for DC-DC converter | Yueh-Se Ho, Jun Lu | 2012-07-10 |
| 8178954 | Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors | Anup Bhalla, Jun Lu | 2012-05-15 |
| 8163601 | Chip-exposed semiconductor device and its packaging method | Yuping Gong | 2012-04-24 |
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Jun Lu, Le Shi, Liang Zhao | 2011-12-13 |
| 6598036 | Method for serving engineering rules on a network through servlet and applet | Nanxin Wang, Beverly Joyce Becker, Gregory A. Kaepp, Fang Liu, Zhengyu Lei | 2003-07-22 |