Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989928 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Chih-Pin Hung | 2011-08-02 |
| 7944038 | Semiconductor package having an antenna on the molding compound thereof | Pao-Nan Lee | 2011-05-17 |
| 7932591 | Stacked semiconductor package having flexible circuit board therein | — | 2011-04-26 |
| 7586184 | Electronic package | Chih-Pin Hung, In-De Ou, Yung-Hui Wang | 2009-09-08 |
| 7550836 | Structure of package on package and method for fabricating the same | Che-Ya Chou | 2009-06-23 |
| 7297877 | Substrate with micro-via structures by laser technique | — | 2007-11-20 |
| 7248134 | Inductor and capacitor formed of build-up vias | Sung-Mao Wu, Chih-Pin Hung | 2007-07-24 |
| 7145428 | Circuit substrate | — | 2006-12-05 |
| 7084639 | Impedance standard substrate and method for calibrating vector network analyzer | Sung-Mao Wu | 2006-08-01 |
| 7072780 | Impedance standard substrate and correction method for vector network analyzer | Sung-Mao Wu | 2006-07-04 |
| 7053627 | Impedance standard substrate and method for calibrating vector network analyzer | Sung-Mao Wu | 2006-05-30 |
| 6933605 | Semiconductor package | Su Tao, Sung-Mao Wu | 2005-08-23 |
| 6770979 | Semiconductor package and substrate thereof | Ted Wang, Samuel Wu, Jenny Chen | 2004-08-03 |
| 6403896 | Substrate having specific pad distribution | Shu Jung Ma, Chang-Chi Lee | 2002-06-11 |