Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979897 | Package substrate for improving electrical performance | — | 2005-12-27 |
| 6489682 | Ball grid array semiconductor package and substrate therefor | Yung-I Yeh, Shiun Jaw Hsien | 2002-12-03 |
| 6448639 | Substrate having specific pad distribution | — | 2002-09-10 |
| 6403896 | Substrate having specific pad distribution | Chi-Tsung Chiu, Chang-Chi Lee | 2002-06-11 |