Issued Patents 2025
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413197 | Band-pass filter circuit and multiplexer | Xiaodong Wang, Chenggong He, Chengjie Zuo | 2025-09-09 |
| 12368428 | 3D filter circuit and 3D filter | Xiaodong Wang, Chenggong He, Chengjie Zuo | 2025-07-22 |
| 12354941 | Chip package structure and storage system | Shu-Liang Ning, Jie Liu, Zhan Ying | 2025-07-08 |
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Li-Hsien Huang, Yao-Chun Chuang, Chih-Lin Wang, Shih-Kang Tien | 2025-07-08 |
| 12349268 | Package component | Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu | 2025-07-01 |
| 12334632 | Antenna assembly and communication system | Kun Qin, Jian Niu, Chengjie Zuo | 2025-06-17 |
| 12334465 | Semiconductor package and method of forming same | Li-Hsien Huang, Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin | 2025-06-17 |
| 12328109 | Filter circuit and electronic device | Qilin SHI, Chengjie Zuo | 2025-06-10 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more | 2025-06-03 |
| 12313675 | Method and device for wafer-level testing | Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu | 2025-05-27 |
| D1072510 | Inflatable sofa | — | 2025-04-29 |
| 12270852 | Method and system for wafer-level testing | Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu | 2025-04-08 |
| 12237226 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Li-Huan Chu, Pei-Haw Tsao | 2025-02-25 |
| 12199352 | Tuning circuit and communication device | Lei Xu, Chengjie Zuo | 2025-01-14 |
| 12186952 | Injection mould and injection moulding method | Jie Liu, Changhao Quan, Zhan Ying | 2025-01-07 |