Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Gang Duan +9 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12255130 | Airgap structures for high speed signal integrity | Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |
| 12230563 | Method to enable 30 microns pitch EMIB or below | Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2025-02-18 |