Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170251 | Semiconductor package | Kyoung Lim Suk, Seokhyun Lee | 2024-12-17 |
| 12087744 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Yeonho Jang | 2024-09-10 |
| 12014975 | Semiconductor package | Kyoung Lim Suk, Minjun Bae | 2024-06-18 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee | 2024-06-18 |
| 11955499 | Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance | Minjung Kim, Dongkyu Kim, Kyounglim Suk, Hyeonjeong Hwang | 2024-04-09 |
| 11901276 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jongyoun Kim, Jungho Park | 2024-02-13 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Inhyung SONG, Kyoung Lim Suk, Wonkyoung Choi | 2024-01-30 |
| 11869775 | Semiconductor packages | Seokhyun Lee, Kyoung Lim Suk, Ae-Nee Jang | 2024-01-09 |
| 11869835 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Yeonho Jang | 2024-01-09 |