Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Kyoung Lim Suk, Jaegwon Jang, Wonkyoung Choi | 2024-01-30 |
IS
Inhyung SONG
Overall (2024): #434,647 of 561,600Top 80%
1
Patents 2024