Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942458 | Semiconductor package including a through-electrode penetrating a molding part | Doohwan Lee, Jeongho Lee | 2024-03-26 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Inhyung SONG, Kyoung Lim Suk, Jaegwon Jang | 2024-01-30 |