Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015014 | Semiconductor package | Jungsoo Byun | 2024-06-18 |
| 11962341 | Electronic device and method for wireless communication | Yousung LEE, Dongil YANG, Hyoseok NA | 2024-04-16 |
| 11942458 | Semiconductor package including a through-electrode penetrating a molding part | Wonkyoung Choi, Jeongho Lee | 2024-03-26 |
| 11901301 | Semiconductor package | Jeongho Lee | 2024-02-13 |