Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170251 | Semiconductor package | Seokhyun Lee, Jaegwon Jang | 2024-12-17 |
| 12014975 | Semiconductor package | Jaegwon Jang, Minjun Bae | 2024-06-18 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Seokhyun Lee, Jaegwon Jang | 2024-06-18 |
| 12009350 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2024-06-11 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Inhyung SONG, Jaegwon Jang, Wonkyoung Choi | 2024-01-30 |
| 11869775 | Semiconductor packages | Seokhyun Lee, Ae-Nee Jang, Jaegwon Jang | 2024-01-09 |