Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170251 | Semiconductor package | Kyoung Lim Suk, Jaegwon Jang | 2024-12-17 |
| 12087744 | Semiconductor package device | Dongkyu Kim, Yeonho Jang, Jaegwon Jang | 2024-09-10 |
| 12057435 | Semiconductor package | Hyeonseok LEE, Jongyoun Kim | 2024-08-06 |
| 12040264 | Semiconductor package including under bump metallization pad | Hyeonjeong Hwang, Kyounglim Suk | 2024-07-16 |
| 12034949 | Video decoding apparatus and video decoding method | Taesung Kim | 2024-07-09 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Jaegwon Jang | 2024-06-18 |
| 12009350 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2024-06-11 |
| 11973028 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2024-04-30 |
| 11942586 | Display module package | Dahye Kim, Jungho Park | 2024-03-26 |
| 11869835 | Semiconductor package | Jongyoun Kim, Yeonho Jang, Jaegwon Jang | 2024-01-09 |
| 11869775 | Semiconductor packages | Kyoung Lim Suk, Ae-Nee Jang, Jaegwon Jang | 2024-01-09 |
| 11858772 | Strip cutting apparatus for diagnostic reagent kit | — | 2024-01-02 |