Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183690 | Semiconductor package | — | 2024-12-31 |
| 12068270 | Semiconductor package | — | 2024-08-20 |
| 12062621 | Semiconductor package | — | 2024-08-13 |
| 12057435 | Semiconductor package | Hyeonseok LEE, Seokhyun Lee | 2024-08-06 |
| 11973028 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2024-04-30 |
| 11948872 | Semiconductor package and method of fabricating the same | Minjun Bae, Hyeonseok LEE, Gwangjae Jeon | 2024-04-02 |
| 11929316 | Semiconductor package and method of fabricating the same | Eungkyu Kim, Gwangjae Jeon | 2024-03-12 |
| 11901276 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jungho Park, Jaegwon Jang | 2024-02-13 |
| 11869835 | Semiconductor package | Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2024-01-09 |