Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087744 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2024-09-10 |
| 11901276 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Jaegwon Jang | 2024-02-13 |
| 11869835 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Jaegwon Jang | 2024-01-09 |