Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040264 | Semiconductor package including under bump metallization pad | Kyounglim Suk, Seokhyun Lee | 2024-07-16 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang | 2024-06-18 |
| 11955499 | Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance | Minjung Kim, Dongkyu Kim, Kyounglim Suk, Jaegwon Jang | 2024-04-09 |