Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2024-09-10 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2024-08-06 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Mitul Modi | 2024-03-26 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Zhimin Wan, Shankar Devasenathipathy, Je-Young Chang | 2024-02-13 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2024-02-13 |