Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 12087746 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao | 2024-09-10 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park +1 more | 2024-02-13 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more | 2024-02-06 |