Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148734 | Transistors, memory cells, and arrangements thereof | Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku, Elliot N. Tan +4 more | 2024-11-19 |
| 12150297 | Thin film transistors having a backside channel contact for high density memory | Noriyuki Sato, Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku +6 more | 2024-11-19 |
| 12148806 | Stacked source-drain-gate connection and process for forming such | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +2 more | 2024-11-19 |
| 12080781 | Fabrication of thin film fin transistor structure | Noriyuki Sato, Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku +6 more | 2024-09-03 |
| 12080605 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2024-09-03 |
| 12040226 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2024-07-16 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 12020929 | Epitaxial layer with substantially parallel sides | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more | 2024-06-25 |
| 12002754 | Multi-height and multi-width interconnect line metallization for integrated circuit structures | Kevin Lin | 2024-06-04 |
| 11996411 | Stacked forksheet transistors | Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan +8 more | 2024-05-28 |
| 11955560 | Passivation layers for thin film transistors and methods of fabrication | Abhishek A. Sharma, Arnab Sen Gupta, Travis W. Lajoie, Sarah Atanasov, Chieh-Jen Ku +5 more | 2024-04-09 |
| 11942416 | Sideways vias in isolation areas to contact interior layers in stacked devices | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +3 more | 2024-03-26 |
| 11916118 | Stacked source-drain-gate connection and process for forming such | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +2 more | 2024-02-27 |
| 11881432 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2024-01-23 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |