Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12166261 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-12-10 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12126068 | Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12126067 | Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 12107314 | Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad | Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Diego Correas-Serrano | 2024-10-01 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +2 more | 2024-09-10 |
| 12088360 | Dispersive waveguide crosstalk mitigation | Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more | 2024-09-10 |
| 12021289 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-06-25 |
| 11955684 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-04-09 |
| 11916604 | Dispersion compensation for electromagnetic waveguides | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more | 2024-02-27 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |